Sun StorageTek SL8500 Modular Library System
 

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Applies to:

Goal

Solution

SL8500 Foam Bumper Addition

This damage is generally caused by falling tools or from other causes related to general movement within the Robotic Interface Module (RIM) during field assembly. Foam bumpers have been added to the RIM to provide protection from such damage during the installation process. The change was implemented on RIM S/N 386.

Aluminum extrusions and copper conductor assemblies can and should be installed with the bumpers in place. It is important that these parts remain in place until just before the arrays are installed in the RIM. Once installed, the arrays adequately protect the corner plastic and corner copper from possible damage.

Each foam bumper is held in place with a single tie wrap. Removal simply requires cutting the tie wrap and pulling the foam off of the corner assembly. After removal, ensure that no foam debris remains on the copper conductor assemblies.

Foam bumpers have been added to the RIM to provide protection from such damage during the installation process (Figure 1).  The change was implemented on RIM S/N 386. 

Aluminum extrusions and copper conductor assemblies can and should be installed with the bumpers in place (Figure 2).  It is important that these parts remain in place until just before the arrays are installed in the RIM.  Once installed, the arrays adequately protect the corner plastic and corner copper from possible damage.   

Each foam bumper is held in place with a single tie wrap (Figure 3).  Removal simply requires cutting the tie wrap and pulling the foam off of the corner assembly.  After removal, ensure that no foam debris remains on the copper conductor assemblies. 

Figure 1:  Bumpers installed in RIM   

 Figure 2:  Ends available for aluminum extrusion and conductor installation

Figure 3:  Tie wrap securing bumper

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