Sun System Handbook - ISO 3.4 June 2011 Internal/Partner Edition | |||
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Solution Type FAB (standard) Sure Solution 1000273.1 : Hardware: The CPU heat sink on the V215 motherboard may generate metal shavings which could induce a thermal event or short circuit.
PreviouslyPublishedAs 200388 Product Sun Fire V215 Server Date of Resolved Release 05-FEB-2007 Part
Impact Conductive metal shavings could create a thermal or short circuit event if they accumulate on the system board, leading to loss of service. Contributing Factors Any Sun Fire V215 system with a serial number of 0646 or lower is potentially affected. Therefore this impacts any V215 system manufactured in year 2006, week 46 or before. Additionally, Sun Fire V215 systems with serial numbers / date codes between and including 0650 through 0647 that shipped to Japan are also impacted. This is due to a rework delay at MSL China which only ships to Japan. Symptoms The CPU heat sink on the Sun Fire V215 system may generate metal shavings due to abrasion after repeated openings and closings of the system cover when it comes in contact with the latch on the rear cover. Root Cause The root cause was an error in design which left no space between the heat sink and the cover. Corrective action was made available in Manufacturing via ECO# WO_34830 starting on February 5, 2007. Systems having a serial number of LL0712FL600G or above are not impacted by this issue. Corrective action was made available in Service in the form of a Tape Kit FRU via ECO# WO_35205 and GSAP 3844 as of March 14, 2007. As of publication date for this asset, no occurrences of this issue in the field have been seen.
Material Availability At the time of this FAB's publication these kits were in extremely short supply. However, it is estimated that a sufficient quantity of kits will be available in all Regions mid to late June of 2007. The above is only an estimate. Please check with your Logistics Representative for more information with regard to material availability before committing a specific remediation timeframe to your customers.
Resolution Hot Swappable: No During next service call... 1. Check for and remove any metal shavings in system 2. Install Tape Kit FRU (Sun p/n 371-2881-01) Kit Installation Instructions: - Open and remove the rear cover. Wipe down the cover if needed, but do not use any cleaning solution as it could interfere with the tape adhesive. - Place the rear cover with the non-label side up. - Take paper off tape. - Stick tape on the rear cover top latch and ensure that the tape edges have firmly adhered to the surface. - Ensure that the tape covers the latch up to the bending curve at the end. - Put the cover back on the system. For detailed Rework Instructions with pictures refer to the below PDF document; http://sdpsweb.central/FIN_FCO/FAB/102933/SPE/Rework_Instructions.pdf Note: Depending on your settings, a blank browser may appear. If this occurs you should save the file locally using File -> Save Page As. Comments This issue was evaluated as an FCO and determined not to meet criteria as there have been no reported incidences of this occurring in the field. Related Information
Previously Published As 102933 Internal Contributor/submitter [email protected] Internal Eng Business Unit Group KE Authors Internal Eng Responsible Engineer [email protected] Internal Services Knowledge Engineer [email protected] Internal Kasp FAB Legacy ID 102933 Internal Sun Alert & FAB Admin Info Critical Category: Significant Change Date: 2007-05-26 Avoidance: Hardware Responsible Manager: [email protected], [email protected] Original Admin Info: WF - completed draft and sent to Extended Review. - Joe 5/24/07 WF - FAB put on hold, per Renate there is no material in Services in order to implement this fix. Escalated this issue back to the submitter who stated these orders were pushed out until mid- June. Also, added a Rework PDF doc into the Corrective Action section per request via the Ext Rvw. - Joe 5/25/07 WF - added verbage in Contributing Factors section describing rework delay at MSL China which cause more impacted systems shipped into Japan. - Joe 9/11/07 Attachments This solution has no attachment |
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