Sun Microsystems, Inc.   Sun System Handbook - ISO 3.4 June 2011 Internal/Partner Edition
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Netra[tm] T3-1 Server: Hardware Specifications

Processor
Number One Netra T3 16-Core 1.65GHz processor
Architecture SPARC V9 architecture, ECC protected
CPUs
  • 1.65GHz 16-Core SPARC T3
  • 128 threads max
  • Sixteen floating-point units
  • Dual multithreaded 10 GbE PCI integrated onto chip
  • On-board cryptography with new Kasumi Bulk algorithm, supporting 12 embedded security industry-standard ciphers:
    DES, 3DES, AES, RC4, SHA1, SHA256, SHA384, SHA512, MD5, RSA to 2048 key, EX, CRC32
Cache memory 6MB integrated L2
Main Memory
Capacities
  • Total DIMM slots: 16 on system board
  • DIMM type: DDR3
  • DIMM size: 4GB or 8GB
  • Maximum capacity: 128GB (16 × 8GB)
Standard Integrated Interfaces
Network 4 × 10/100/1000 Mbps auto negotiating ports
Up to 2 optional 10 GbE XAUI connections
Network Management One dedicated 10/100Base-T RJ-45 port Ethernet port
Serial Management One dedicated RJ-45 port
Remote Management Onboard system processor, running Integrated Lights Out Manager (ILOM)
Graphics One HD-15 VGA connector
USB Front: 2 USB 2.0 Ports
Rear: 2 USB 2.0 Ports
(also 1 internal USB port)
PCI Expansion Slots
  • 5 low-profile PCI-Express 2.0 slots.
  • Slots 0 and 1 support PCI-Express or 10Gbit Ethernet (XAUI) cards.
Slot # Physical Electrical
0 x8 x8
1 x8 x8
2 x8 x8
3 x8 x8
4 x8 x8
Internal Mass Storage
Disks
  • Up to four 2.5-inch SAS-2 disk drives
  • 300GB 2.5-inch SAS disk drives
  • RAID 0 and RAID 1 support
DVD-ROM 1 slimline SATA DVD +/-RW
Power Supplies
2 × 1200 Watt (Type A249A AC or Type D204A DC), hot-swappable, N+1 redundant power supply units (PSU)
Environment
Input Voltage (AC) 100 - 240 VAC, 50-60Hz
(DC) -48 VDC or -60 VDC
Temperature

Operating: 5° C to 40° C (41° F to 104° F)
Short Term Operating: -5° C to 55° C (23° F to 131° F)
Nonoperating: -40° C to 70° C (-40° F to 158° F)

Humidity Operating: 5% to 85% relative humidity noncondensing
Short Term Operating: 5% to 90% relative humidity noncondensing, but not to exceed 0.024 kg water/kg dry air (0.053 lb. water/2.205 lbs. dry air)

Nonoperating: 93% relative humidity noncondensing, 40° C, 104° F) maximum wet bulb
Altitude Operating: up to 3000m/40° C (9842 ft.) and 4000m/435° C (13123 ft.)
Nonoperating: up to 12000m (40000 ft.)
Acoustic Noise Operating/Idling: 7.2 B (LwAd, 1B = 10dB)
Operating/Idling: 63dB (LpAm, bystander positions)
Regulations
Meets or exceeds the following requirements:
Safety UL/CSA C22.2 60950-1, 2nd Edition EN 60950-1, 2nd Edition, IEC 60950-1 :2005 2nd Edition CB Scheme with all national differences, IEC 825-1,2 and CFR21 part 1040
RFI/EMI EN55022:2006+A1:2007/CISPR22:2005+A1:2005+A2:2006 EN300 386 V1.4.1 Class A, FCC CFR 47 Part 15 Class A
Immunity EN55024/CISPR 24, EN 61000-3-2, EN 61000-3-3
Regulatory Markings CE, FCC, ICES-003, C-tick, VCCI, GOST-R, BSMI, MIC, UL/cUL, S-mark, CCC
Other Restriction of Hazardous Substances (RoHS) labeled, per WEEE (Waste Electrical and Electronics Equipment) Directive (2002/95/EC)
Telecommunications EN 300 386
Dimensions and Weight
Height 87.1 mm (3.43 in.)
Width 445 mm (17.52 in.) including bezel
Depth 526 mm (20.71 in.) max to PSU handles
Depth 501 mm (19.72 in.) max to rear I/O
Weight Appx 18.6kg (41 lbs) - with 2 power supplies and 4 disk drives, but without PCI cards installed

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