Sun Microsystems, Inc.   Sun System Handbook - ISO 3.4 June 2011 Internal/Partner Edition
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Sun Netra 6000 Modular System: Hardware Specifications

Notes:
  • The Sun Netra 6000 Modular System is a NEBS Level 3 Certified version of SB6000.
  • These specifications are for the Sun Netra 6000 chassis. Memory, CPU, storage, and I/O are Server Module (Blade) specific.
  • Reference the Sun System Handbook's Sun Netra 6000 home page to find supported Server Modules.
Capacity
Number
  • Up to 20 optional, hot-pluggable PCI ExpressModules (EM).
  • Up to 2 optional, hot-pluggable PCI Express Network Express Modules (NEM).
  • Up to 10 hot-pluggable Sun Netra Server Modules.
  • 2 (N+1), hot-plug / hot-swap power supplies with independently wired fans.
  • 2 Front Fan Modules (6 fans total).
  • 6 Rear Fan Modules (12 fans total, N + 1 redundancy)
  • One Chassis Monitoring Module (CMM).
Management Environment
Sun Netra 6000 Chassis Monitoring Module (CMM)
  • Sun Netra 6000 chassis-level management is provided by the CMM's Integrated Lights-Out Management (ILOM) software. ILOM 3.0.6.11 is the minimum supported firmware version.
  • Management can be integrated into Sun and/or third-party management tools.
  • Two ways to connect to CMM ILOM:
    • Connect a terminal or terminal emulation software to the SER MGT (RJ-45) port of the CMM to telnet into CMM ILOM.
    • Connect to the NET MGT 0 (10/100Base T ethernet) port of the CMM for Secure Shell (SSH) client access to CMM ILOM.
Power Supplies
Number Two, hot-plug / hot-swap, high-efficiency(~90%) power supplies are provided in a N+1 redundant configuration.
Output AC: 5600-Watt per power supply.
DC: 2500-Watt per power supply
AC / DC Input Connection
  • Americas/domestic: NEMA L6-20P to IEC 320-C19.
  • International: IEC 309, 250 V, 16 A, 3Pin to IEC 320-C19.
  • DC input connection is lug and post. See Install Guide for specifications.
Standard Integrated Interfaces
Network The Sun Netra 6000, without an optional EM or NEM, does not offer production network or I/O connectivity.
I/O Interfaces The Sun Netra 6000 Modular System I/O is architected using PCI Express technology. I/O is offered in two form factors: PCI Express ExpressModules (EM) and PCI Express Network Express Modules (NEM).
Environment
Airflow Requirements
  • Airflow (maximum) airflow inlet/outlet rate):1012 CFM (Cubic Feet per Minute).
  • Airflow (typical): 600 CFM (Cubic Feet per Minute).
  • Airflow direction: Front to rear.
Temperature Operating: 5°C to 45°C (41° F to 113° F).
Nonoperating: -40°C to 70°C (-40° F to 158° F).
Optimum ambient temperature: <22° C (71.60° F).
Relative Humidity Operating: 5% to 85% RH, non-condensing not to exceed 0.024kg Short Term.
Nonoperating: 93%, non-condensing, 38° C max wet bulb.
Altitude Operating:0 to 6,000 feet (1,800m), max. at aisle ambient temperatures of 45°C.
Nonoperating: Up to 39,370 feet (12,000m).
Acoustic Noise LwAd (1 B = 10 dB) 7.5 B at or below 25°C, 9.2 B at max. ambient.
Sine Vibration Operating: Z (vertical)-axis: 0.15G X/Y axis: 0.10G 5 to 500 Hz sine.
Nonoperating: Z (vertical)-axis: 0.50G X/Y axis: 0.25G 5 to 500 Hz sine.
Shock 3Gs, 11msec, half sine (applied to rackmounted enclosure).
Regulations
NEBS Compliance Level NEBS Level 3 Certification
RoHS Compliance Level RoHS:YL
Product Safety
  • Product safety: UL/CSA 60950-1, EN 60950-1, IEC 60950-1 CB Scheme with all country differences, IEC 825-1, 2, CFR 21 Part 1040, CNS 14336, GB 4943.
  • Other: Labeled per WEEE (Waste Electrical and Electronic Equipment) Directive, China RoHS Mark.
Dimensions and Weights
Chassis Height AC Chassis: 438.15mm (17.25 in) - 10 RU minus clearance.
DC Chassis: 1 RU, or 1.75" taller than the DC Chassis Height.
Chassis Width 444.5mm (17.50 in).
Chassis Depth 692.15mm (27.25 in).
Chassis Depth (in rack) 27.25 inches (692 mm) (distance from front vertical mounting rail to rear of the chassis).
Weight Fully configured system 160kg (350 lbs).
Empty Chassis:
35.7kg (78.7lbs).
Rack Mounting
AC Chassis=10R / 4 chassis max per 42U rack.
DC Chassis=11R / 3 chassis max per 42U rack.

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