Sun Microsystems, Inc.   Sun System Handbook - ISO 3.4 June 2011 Internal/Partner Edition
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Thermal Grease

310-0049

310-0065

Syringe 310-0049 includes 0.5gm of Shin-Etsu G751 in a 1cc syringe with approximately 0.25 - 0.30cc of thermal grease.

Shin-Etsu G751 Properties

Viscosity 400 Pascal/Second
Specific Gravity 2.5
Appearance Grey
Thermal Conductivity 4.5 W/m°K
Volatile Content <1.0%

Syringe 310-0065 includes 0.5gm of Shin-Etsu X23-7783D in a 1cc syringe with approximately 0.25 - 0.30cc of thermal grease. The syringe shown includes 1.5gm of Shin-Etsu X23-7783D. Do not use this volume of thermal grease on a single CPU.

Thermal Grease Kit 350-1271 includes 0.5gm of Shin-Etsu X23-7783D in a 1cc syringe and one 250-1802 Cleaning Wipe. This kit is required when replacing a Sun Fire X4150 Power Distribution Board.

Shin-Etsu X23-7783D Properties

Viscosity 200 Pascal/Second
Specific Gravity 2.6
Appearance Grey
Thermal Conductivity 6.0 W/m°K
Volatile Content <2.6%

CPU and Heatsink FRU's and options may include Cleaning Wipe 250-1802. The approved wipe is CleanTex CT801Z, formerly CLTX-801Z. Shipments may include ACL Staticide or Techspray 1610 wipes which are not on the approved vendor list.


CleanTex CT801Z
91% Isopropyl Alcohol
9% Deionized Water


ACL Staticide
30-40% Isopropyl Alcohol
55-60% Deionized Water
1% Ethanol

Techspray 1610
98.8% Isopropyl Alcohol

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